Nubis Communications, Inc., a leader in high-density optical interconnects, and Ericsson are showcasing groundbreaking 6G RAN solutions at the European Conference on Optical Communication (ECOC) 2024 in Frankfurt, Germany. The technology demonstration highlights advancements in data transmission, reduced power consumption, and simplified hardware deployment for next-generation mobile networks.
Path to Power-Efficient 6G RAN
Nubis’ award-winning XT1600™ optical engine is the centerpiece of the demonstration, showcasing its ability to deliver high-density data transmission with ultra-low power consumption. The technology is specifically designed for remote radio head use in future 6G radio access networks (RAN), addressing the challenges of limited space and power on cell towers.
The XT1600 enables terabit-per-second data transmission in radio units, crucial for future mobile infrastructure, where cooling systems are often impractical. By relocating the laser off the radio head mast and connecting it via standard single-mode telecom fiber, the solution minimizes space and power usage while maintaining operational efficiency.
Co-Packaged Optics for Mobile Networks
The demonstration at ECOC 2024 features an innovative architecture integrating high-speed silicon photonics and analog electronics within the radio unit. This co-packaged optics (CPO) design allows the radio unit to operate without cooling, thanks to patented safety mechanisms that ensure eye protection in the event of a fiber cut.
Ericsson’s Technology Review article notes the significance of this demonstration for future mobile networks, including 6G. It emphasizes the solution’s capability to perform at high temperatures in radio units, maintain compatibility with standard optical fibers, and include automated eye-safety mechanisms.
Nubis Participation at ECOC 2024
Nubis experts are actively participating in several ECOC sessions, including discussions on AI, cloud trends, and quantum technologies. The company’s innovations in photonics, electronics, and packaging are driving advancements in scalability, density, and energy efficiency across both AI data centers and next-generation mobile networks.
Source: businesswire.com
