E&R Engineering Corp. introduced the “E-Core System” on August 28, 2024, in Taipei, Taiwan, forming the “Glass Substrate Supplier E-Core System Alliance.” This initiative brings together industry leaders to advance the mass production of glass substrates, offering next-generation advanced packaging solutions to global markets.
Strategic Partnerships Drive Innovation in Glass Substrate Technology
The E-Core Alliance includes prominent partners such as Manz AG, Scientech, ShyaWei Optronics, and others, uniting to optimize glass substrate processes. E&R Engineering’s collaboration with these industry giants aims to meet the growing demand for AI chips and high-speed communication devices, positioning glass substrates as a superior alternative to traditional materials.
Breakthrough in Glass Laser Modification Enables Mass Production
After years of development, E&R has mastered the glass laser modification (TGV) process, achieving unprecedented speeds of up to 8,000 vias per second. This significant advancement allows glass substrates to meet mass production requirements, marking a new era in semiconductor and substrate manufacturing.
E&R will showcase these cutting-edge technologies at SEMICON Taiwan 2024 and SEMICON Europa 2024.
Source: prnewswire.com
